Publication of Department of Electrical Engineering annual year 2013-14

 Electrical Engineering

Book chapters

1. R. Sharma, R. Saha, and P.A. Kohl, "Low-Loss, High-Performance Chip-to-Chip Electrical Connectivity using Air-Clad Copper Interconnects," in High-speed Photonics Interconnects, Eds.: Lukas Chrostowski and Krzysztoflniewski, CRC Press, 2013.

Journals

1. A. K. Nishad, and R. Sharma, ''Analytical Time Domain Models  for  Performance  Optimization of Multilayer GNR Interconnects", IEEE J. Sel. Top. Quant., vol. 20, no.1, 2014.

2. R. Mulaveesala, "Thermal Non-destructive Testing and Evaluation: Coming of Age," J. Inform Tech. Soft. En g., vol. 3, no. 2, 2013 .

3. V. Arora, K. Rawat, R. Mulaveesala, and S. Tuli, "Effects of varying bandwidth on frequency modulated thermal wave imaging", J. NOT & E, vol.12, no.2, pp. 31-35, 2013.

4. G. Dua, J.A. Siddiqui, R. Mulaveesala, and B. Venkataraman, "Non-stationary thermal wave imaging for non-destructive testing of  carbon fibre reinforced plastics," J. NOT & E, vol. 12, no.2, pp. 27-30, 2013.

5 .V. Arora, and R. Mulaveesala, "Pulse compression with Gaussian weighted chirp modulated excitation for infrared thermal wave imaging;' Pr. Electromagn. Res. Lett., vol. 44, pp. 133-137, 2014.

6. S. Roy, "Performance prediction of active pitch­ regulated wind turbine with short duration variations in source wind." Appl. Energy, vol. 114,pp.700-708, 2014.

7. S. Roy, "Power output by active pitch-regulated wind turbine in presence of short duration wind variations", IEEE T. Energy Conver., vol. 28, no. 4, pp.1018-1023,   2013.

8. C. C. Reddy, A.P.S. Tiwana, A. Gupta, and J.S. Chahal, "Role of interfacial surface area on the physical phenomena of nanocomposites", JET J. Micro & Nano Lett., vol. 8, no.11, pp.841-844, 2013

9. G. Dua, and R. Mulaveesala, ''Applications of Barker coded infrared imaging method for Characterization of glass fibre reinforced plastic materials", Elect. Lett., vol. 49, no.17, 2013.

Conference proceedings

1. J.S. Chahal, and C.C. Reddy, "Transmission Line Model for Acoustic Signal Propagation in PEA System," in proc. IEEE CONECCT, Bangalore, 2014 .

2. A. Gupta, and C.C. Reddy, "Sparse de-convolution of space charge signal in PEA method," in proc. IEEE Int. Conf. Signal Processing, Computing and Control, Solan, 2013.

3. A. P. S. Tiwana, and C.C. Reddy, "Design and development of microcontroller driven, portable, low-cost HVDC source," in proc. IEEE Int. Conf. Signal Processing, Computing and Control, Solan, 2013.

4. A. P .S. Tiwana, and C.C. Reddy, "Some Investigations on Temperature Dependent Breakdown of Electric Cables under no Load," in proc. IEEE Catcon, Kolkata, 2013.

5. R. Mulaveesala, J.A. Siddiqui, V. Arora, V.S. Ghali, and M. Amarnath, "Nondestructive testing and evaluation of composites by non-invasive IR Imaging techniques," in Proc. SPIE, 2013.

6. R. Mulaveesala, V.S. Ghali, V. Arora, J.A. Siddiqui, and M. Amarnath, "Theory, modeling, and simulations for thermal wave detection and ranging," in Proc.SPIE, 2013 .

7. R. Mulaveesala, V.S. Ghali, V. Arora, J.A. Siddiqui, and M. Amarnath, "Recent advances in thermal wave detection and ranging for non-destructive testing and evaluation of materials," in Proc. SPIE,2013.

8. A. R. Akula, R. Mulaveesala, S. Kumar, S. Tewary,H.K. Sardana, and R. Ghosh, "Pulse Compression Approach for frequency modulated thermal wave imaging based subsurface defect analysis," in Proc.APCNDT, Mumbai, 2013.

9. S. Tewary, A. Akula, R. Ghosh, R. Mulaveesala, S. Kumar, and H.K. Sardana, "Detection of subsurface defects using active infrared thermography," in Proc. APCNDT, Mumbai, 2013.

10. V. S. Ghali, S. Subhani, and R. Mulaveesala, "Applications of feature separation based subsurface analysis for frequency modulated thermal wave imaging," in Proc. APCNDT, Mumbai, 2013.

11. A. Bhowmik, R. Repaka, R. Mulaveesala, and S.C. Mishra, "Thermal characterization of varying subcutaneous fat thickness using thermal wave imaging technique," in proc. 22nd National and 11th ISHMT - ASME Heat & Mass Transfer Conf., Kharagpur, 2013.

12. A. Bhowmik, R. Repaka, S.C. Mishra, and R. Mulaveesala, "Detection  of  subsurface  skin lesion  using  frequency  modulated   thermal wave imaging: a numerical study;' in proc. Int. Mechanical Engineering Congress & Expo., San Diego, 2013.

13. R. Sodhi, "Evaluating PMU Site Performance using MultiAttribute Theory," in proc.  IEEE Conf. on Innovative Smart Grid Technologies, Bangalore, 2013.

14. E. Uzunlar, R. Sharma, R. Saha, V. Kumar, R. Bashirullah, A. Naeemi, and P.A. Kohl, "Design and Fabrication of Ultra Low-Loss, High­ Performance 3D Chip-Chip Air-Clad Interconnect Pathway", in proc. 63rd IEEE Electronic Components and Technology Conf., Las Vegas, 2013 .

15. T. Agrawal, P.K. Biswas, A.O. Raoot, and R. Sharma, "Optimum Frame Size Evaluation Framework for Efficient Tag Identification in Passive RFID Systems", in proc. IEEE Wireless Power Transfer Conf., Perugia, 2013.

 

16. P. Kumar, A. Singh, A. Garg, and R. Sharma, "Compact Models for Transient Analysis of Single-layer Graphene Nanoribbon Interconnects", in proc. 15th Int. Conf. on Computer Modelling and  Simulation, Cambridge University, 2013 .